We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Heat dissipation board.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Heat dissipation board Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Heat dissipation board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. ダイワ工業 Nagano//Electronic Components and Semiconductors
  2. null/null
  3. 三昌製作所 Kyoto//Manufacturing and processing contract
  4. 4 ＴＳＳ Kanagawa//Electronic Components and Semiconductors
  5. 5 共和産業 Aichi//Manufacturing and processing contract
Go to Company Ranking

Heat dissipation board Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Heat-dissipating substrate "DPGA" ダイワ工業
  2. Heat dissipation substrate
  3. Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink] 三昌製作所
  4. 4 3D metal substrate, flexible heat dissipation substrate ＴＳＳ
  5. 5 Release the heat - Matsuwa's heat dissipation board 松和産業 本社

Heat dissipation board Product List

1～9 item / All 9 items

Displayed results
Heat-dissipating substrate "DPGA"

Heat-dissipating substrate "DPGA"

This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
3D metal substrate, flexible heat dissipation substrate

3D metal substrate, flexible heat dissipation substrate

Industry first! We can manufacture bendable metal substrates!

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High Brightness High Current LED Heat Dissipation Substrate "MMMS Substrate"

High Brightness High Current LED Heat Dissipation Substrate "MMMS Substrate"

Achieving fine three-dimensional MEMS structures through plating! It realizes high heat dissipation and can accommodate large currents.

The "Mmemus substrate" is a heat dissipation substrate for high-brightness, high-current LEDs that integrates unique plating technology with MEMS technology to accommodate various electronic devices. It achieves fine three-dimensional MEMS structures through plating. Vertical fine plating with pattern widths of several tens of micrometers is possible using semiconductor photoprocessing. High-speed film formation through plating allows for the creation of fine three-dimensional thick film structures over 50μm in thickness, and by using a unique seed layer, high reliability is achieved. 【Features】 ■ Thick film structure unique to plating (over 50μm) ■ Dense, low-stress, and high adhesion is possible - Can be created on nitrogen aluminum substrates with excellent insulation and heat resistance ■ Achieves high heat dissipation and can handle high currents - Mounting substrates for LD/LEDs and power supply circuits - MEMS components such as micro springs/switches and package cap arrays *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other contract services
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat-dissipating substrate "Thick Copper Special Substrate"

Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation substrate "Heat dissipation Via"

Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.

Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Release the heat - Matsuwa's heat dissipation board

Release the heat - Matsuwa's heat dissipation board

Hot summer. Matsuwa's circuit boards are super COOL! Thick copper, metal, copper inlay boards, etc. For heat dissipation boards, please consult Matsuwa Industries.

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation substrate

Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Heat dissipation board

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.